| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic package reducing a change in characteristic of a semiconductor chip due to strain accompanying a change in temperature. SOLUTION: The ceramic package is formed by stacking a first-layer green sheet 51 to a sixth-layer green sheet 56 in order from above and baking them. The sixth-layer green sheet 56 having a wiring pattern 41 has a dummy pattern 60 on an end surface 562 opposite to the wiring pattern 41. The dummy pattern 60 has the inverted shape of the shape of the wiring pattern 51. Consequently, when the green sheets are stacked and baked, deformation by the wiring pattern 41 and deformation by the dummy pattern 60 cancel each other in the sixth-layer green sheet 56. Consequently, deformations of the sixth-layer green sheet 56, the fifth-layer green sheet 55, and the fourth-layer green sheet 54 having a die attaching surface 31 are reduced. COPYRIGHT: (C)2009,JPO&INPIT
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