| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment device capable of improving throughput when repeating a series of treatment in which a plurality of substrates in a container are taken out for specified treatment, and then the substrates are returned into the container. SOLUTION: A cleaning treatment device comprises a control part 40 for controlling a series of transportation actions. The control part 40 comprises a schedule generating part 54 which generates a transportation schedule in which a hoop that houses a non-treated substrate of a succeeding lot is transported to a wafer delivery stage 15 at such timing as a hoop transportation device 12 and the wafer delivery stage 15 are vacant while a substrate of one wafer is fed in the treatment device with the action timing of the hoop transportation device 12, the operation timing with the wafer delivery stage 15, and the action timing of a wafer transportation device 19 so separately adjusted as the total transportation time becomes appropriate. COPYRIGHT: (C)2009,JPO&INPIT |
