| 摘要 |
PROBLEM TO BE SOLVED: To provide an acrylic resin for semiconductor device adhesive that is preferably used for a semiconductor device of a high-density three-dimensional mounting package or the like and has excellent adhesiveness and reliability. SOLUTION: An acrylic resin for semiconductor device adhesive is obtained by copolymerizing acrylic acid alkyl ester of 82 to 99 wt.% and glycidyl (meth)acrylate of 1 to 18 wt.%, and has a weight-average molecular weight of 1,000,000 to 1,500,000 and a glass transition temperature of -35°C to -45°C. COPYRIGHT: (C)2009,JPO&INPIT
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