| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device using a hollow package that controls a rise of internal pressure because of thermal expansion inside the hollow package, improves air-tightness and humidity resistance, and further, is easy to produce. SOLUTION: A frame-like circuit substrate 24 is bonded with an adhesive to a glass substrate 22, to which a semiconductor element 30 is connected with a flip-chip. On the circuit substrate 24, a spacer substrate 34 that surrounds the semiconductor device 30 is set up. The semiconductor device 30 is sealed by a sealing resin 42. A package of the semiconductor device 20 becomes a thin package controlling the height, thus enabling a space 44 to be made a smallest possible capacity. Further, the circuit substrate 24, the adhesion part between the circuit substrate 24 and the glass substrate 22, and the semiconductor device 30 are covered by a moisture barrier 40, thus preventing moisture from entering the space 44. COPYRIGHT: (C)2009,JPO&INPIT
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