| 摘要 |
#CMT# #/CMT# The arrangement (10) has a sensor chip (1) i.e. silicon wafer, mounted over an intermediate carrier i.e. ceramics carrier (2), on a housing base (3), where the sensor chip is made of a semiconductor material. The housing base is made of a material having thermal expansion coefficients different from that of the semiconductor material of the sensor chip. The intermediate carrier has a thermal expansion coefficient that is adapted to the thermal expansion coefficients of the semiconductor material of the sensor chip. #CMT#USE : #/CMT# Pressure sensor arrangement for use in a high pressure application e.g. air, fuel or oil pressure application such as transmission application, and air conditioning system, of a motor vehicle. Can also be used for pneumatic brake and air cushioning applications. #CMT#ADVANTAGE : #/CMT# The arrangement can withstand high compressive load, and can be produced and assembled in a simple manner. The thermal expansion coefficient of the intermediate carrier is adapted to the thermal expansion coefficients of a semiconductor material of the sensor chip, so that a very good stress uncoupling between the sensor chip and housing base can be obtained. The carrier can be configured as a printed circuit board so as to adjust sensor components in multiple cuts, thus reducing production cost of the sensor arrangement. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a schematic sectional view of a pressure sensor arrangement. 1 : Sensor chip 2 : Ceramics carrier 3 : Housing base 10 : Pressure sensor arrangement 14 : Pressure port. |
