IMAGE SENSOR MODULE AND FABRICATION METHOD THEREOF
摘要
<p>An image sensor module having a sensor chip closely adhered on a concave surface and a fabrication method thereof are disclosed. The image sensor module includes at least one sensor chip, at least one sensor chip-mounting structure comprising a substrate and a polymer layer formed on the substrate, the polymer layer having an concave surface formed on an upper part thereof by a polymer molding method, so that the sensor chip is bent and bonded on the concave surface, and at least one lens fixed on the at least one sensor chip-mounting structure above the sensor chip.</p>
申请公布号
KR20090044901(A)
申请公布日期
2009.05.07
申请号
KR20070111185
申请日期
2007.11.01
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
CHOI, MIN SEOG;LEE, SEUNG WAN;KIM, WOON BAE;LEE, EUN SUNG;JUNG, KYU DONG;KIM, CHE HEUNG