| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a piezoelectric device which uses a glass wafer containing metal wires and is manufactured in wafer by wafer. <P>SOLUTION: A piezoelectric device 100 includes a piezoelectric vibrating piece 20 having a first electrode pattern 23 and a second electrode pattern 24, a glass base 45 having a first surface and an opposite second surface and has the piezoelectric vibrating piece 20 placed thereon, and a lid 65 for sealing up the piezoelectric vibrating piece. The glass base 45 includes first and second metal wires 43 and 44 having side surfaces of end parts exposed to the first surface and the second surface, and the end parts of the first and second metal wires 43 and 44 exposed to the first surface are connected to the first and second electrode patterns 23 and 24 respectively. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
