发明名称 MOLD RELEASING FORCE MEASURING DEVICE, MOLD RELEASING FORCE MEASURING METHOD, RESIN MOLDING DEVICE AND MANUFACTURING METHOD OF RESIN MOLDED ARTICLE
摘要 PROBLEM TO BE SOLVED: To provide a mold releasing force measuring device which can perform the precise measurement of a mold releasing force by one measurement by relatively reducing a sliding resistance force of an ejector pin, to provide a mold releasing force measuring method, to provide a resin molding device, and to provide a manufacturing method of a resin molded article. SOLUTION: The mold releasing force measuring device is provided with a first mold, a second mold which forms a cavity in cooperation with the first mold, an ejector pin whose tip is protruded to the cavity in the first direction, and a load measuring means arranged at the rear end of the ejector pin to measure a force applied on the ejector pin. A cross section of the cavity in a direction orthogonal to the first direction is circular, a ratio of a diameter of the cavity bottom to a diameter of the front edge of the ejector pin is in a range of (12.5:1) to (15:1), and a draft angle of the cavity is 1 degree or smaller. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009096120(A) 申请公布日期 2009.05.07
申请号 JP20070271525 申请日期 2007.10.18
申请人 TOSHIBA CORP 发明人 SAYAMA SATOSHI;AOKI YUKINORI;SUZUKI TAKAHIRO
分类号 B29C45/40;B29C45/76 主分类号 B29C45/40
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