发明名称 |
Method for manufacturing a substrate for mounting a semiconductor element |
摘要 |
A method for manufacturing a substrate for mounting a semiconductor element includes: a step for forming a predetermined resist pattern by affixing resists on both faces of a base material including a metallic thin plate and using the resist of one of the faces as a masking for plating; a step for performing an etching of a predetermined position on a base material exposed from the resist pattern; a step for forming a plating layer having at least three layers including a lower, a middle, and an upper layer on the etched base material; a step for separating the resists affixed to both faces of a base material; and a step for performing an etching of the middle plating layer to make the middle plating layer narrower than the upper and lower plating layers. |
申请公布号 |
US2009114345(A1) |
申请公布日期 |
2009.05.07 |
申请号 |
US20080289473 |
申请日期 |
2008.10.28 |
申请人 |
SUMITOMO METAL MINING CO., LTD. |
发明人 |
NAKAYAMA HIROKI;MIKAMI JUNTAROU |
分类号 |
B29C63/00 |
主分类号 |
B29C63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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