| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve detection accuracy in a position of a recognition mark having a minute pattern shape. <P>SOLUTION: The semiconductor substrate includes: a first recognition mark 11 arranged on a frame part 3 in an outer peripheral part of a mounting region 2 with a plurality of semiconductor chips mounted thereon, and used for macroscopically detecting positions by a recognition camera; and second recognition marks 12 formed smaller than the first recognition marks 11, and used for microscopically detecting positions by the recognition camera. The second recognition mark 12 has a center line arranged on an extension line of a dicing line 4, and has a pattern shape formed line-symmetrically with respect to the center line. The pattern shape is formed such that a ratio occupying in a direction parallel to the dicing line 4 is larger than a ratio occupying in a direction vertical to the dicing line 4, and includes a flowage region 13 facilitating flow of an etchant for forming the pattern shape. <P>COPYRIGHT: (C)2009,JPO&INPIT |
