| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer scratch detection device, and to provide a grinder equipped with the scratch detection device. SOLUTION: This grinder comprises a chuck table for holding a wafer and a grinding means, having a grinding wheel for grinding the wafer held on the chuck table. The grinder further comprises the scratch detection means for detecting the scratches produced on the ground surface of the wafer. The scratch detection means comprises a light beam irradiation means for making a light beam irradiated to the wafer 11; a photodetector 108, disposed on the upper side of the area to which the light beam is radiated a light-collecting means for collecting the reflected light from the region to which the light beam is radiated and guiding the collected light to the photodetector; and a scratch determination means 110 for determining that there are scratches, when the light quantity detected by the photodetector exceeds a predetermined threshold. COPYRIGHT: (C)2009,JPO&INPIT |
