发明名称 POWER SUPPLY WIRING METHOD FOR SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, POWER SUPPLY WIRING PROGRAM FOR SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, DESIGN SUPPORT SYSTEM FOR SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, AND ELECTRONIC INSTRUMENT
摘要 PROBLEM TO BE SOLVED: To provide a power supply wiring method for a semiconductor integrated circuit device, which achieves the efficient power supply wiring for reducing the modifying work after the power supply wiring and for facilitating the signal wiring in post processing when carrying out the wiring connection of a power supply line to a power supply ring such as an IP module etc., and to provide a power supply wiring program and a design support system. SOLUTION: The power supply wiring method comprises: the module arranging step (S12) of arranging a module so that one of a first direction or a second direction coincides with the power supply wiring direction; the power supply wiring candidate region setting-up step (S16) of setting up a region along the power supply wiring direction including a portion provided along the first direction or the second direction coinciding with the power supply wiring direction of the power supply ring included in the arranged module as a power supply wiring candidate region; and the power supply line wiring step (S20) of wiring the power supply line along the power supply wiring direction in the power supply wiring candidate region and connecting it to the power supply ring. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009099588(A) 申请公布日期 2009.05.07
申请号 JP20070266712 申请日期 2007.10.12
申请人 SEIKO EPSON CORP 发明人 TORII KENSUKE
分类号 H01L21/82;G06F17/50 主分类号 H01L21/82
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