LEADLESS SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

摘要

A package (50) to encase a semiconductor die (40) is manufactured by the following steps. First, an electrically conductive frame is provided. This frame has a plurality of leadframes (14) arranged in a matrix with each leadframe (14) having a plurality of spaced leads (16) extending outwardly from a central aperture. The electrically conductive frame further includes a plurality of connecting bars joining outer end portions of adjacent ones of the leadframes (14). Second, a groove is formed in the connecting bars to form a reduced thickness portion between the outer end portions of adjacent ones of the leadframes (14). Third, a semiconductor die (40) is electrically coupled (42) to inner portions of said leads (16). Fourth, the frame and the semiconductor die (40) are encapsulated in a molding compound (46). Finally, the molding compound (46) and the frame are cut along the grooves to form singulated semiconductor packages (50) having outer lead portions with a height greater than the height of the reduced thickness portion.