| 摘要 |
According to the invention, when soldering a heat dissipating element to an electronic component, a large proportion of the soldering agent is lost and the transition surface actually coated with soldering agent and the transport of heat therefrom is very low. The novel heat dissipating element is designed in such a way that it allows for improved heat dissipation. In order to improve heat dissipation from a component to the heat dissipating element, the inventive heat dissipating element comprises a container which acts as a solder reservoir and produces additional soldering agent during soldering. Said type of heat dissipating element is primarily suitable for electric or electronic components which contain components having a high operation temperature and a long working life, such as in brake control devices in vehicles. |
