| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a nickel-carried solder ball used for conductive connection between fine electrodes and having excellent adhesion with the electrodes, and in which disconnection caused by the breakdown of the joining boundary with each electrode is hardly caused. <P>SOLUTION: In the nickel-carried solder ball, on the surface of a solder ball composed of a tin-containing low melting point metal, nickel is carried in a state where a discontinuous layer is formed. <P>COPYRIGHT: (C)2009,JPO&INPIT |
