| 摘要 |
<p>Disclosed is a polyimide film for insulating material prepared by reacting an acid anhydride and diamine compounds comprising p-phenylenediamine. The polyimide film has excellent electric properties such as a coefficient of thermal expansion, an elongation, a intensity, a dielectric strength and a bulk resistance, and suitable for use in a TAB tape employing a polyimide film, and a flexible printed wiring board.</p> |
