METHOD OF MANUFACTURING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate, that correctly etches a conductor formed on the surface of the substrate in the production steps for substrates including a step of forming a through-hole in the substrate and fill it with an insulating material.

SOLUTION: The method includes the steps of: forming a through-hole 18 in a substrate 16; filling the through-hole 18 with an insulating material 20 and performing electroless plating to coat the surface of the substrate 16; applying photoresist on the electroless-plated layer 80 formed on the surface of the substrate 16; optically exposing and developing the photoresist so as to form a resist pattern 72 coating an end face of the through-hole 18 filled with the insulating material 20; etching conductor layers 14 and 19 formed on the surface of the substrate 16 while using the resist pattern 72 as a mask; and removing the resist pattern 72 coating the end face of the through-hole 18 from the substrate 16 while using the electroless-plated layer 80 as a release layer.

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