发明名称 EEPROM and Method of Manufacturing the Same
摘要 An EEPROM includes a substrate, a first semiconductor layer and a second semiconductor layer formed on the substrate. The first semiconductor layer is isolated from the second semiconductor layer by a trench. A first source and a first drain are located at two opposing sides of the first semiconductor layer. A first dielectric layer is formed on the first semiconductor layer, and a first floating gate is formed on the first dielectric layer. A second source and a second drain are located at two opposing sides of the second semiconductor layer. A second dielectric layer is formed on the second semiconductor layer, and a second floating gate is formed on the second dielectric layer. The first floating gate and the second floating gate are electrically connected.
申请公布号 US2009117698(A1) 申请公布日期 2009.05.07
申请号 US20080180521 申请日期 2008.07.26
申请人 CHAO CHIH-WEI;HU CHIN-WEI;CHEN CHI-WEN 发明人 CHAO CHIH-WEI;HU CHIN-WEI;CHEN CHI-WEN
分类号 H01L21/336 主分类号 H01L21/336
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