| 摘要 |
<p>A microdevice ( 20, 120, 220 ) having a hermetically sealed cavity ( 22, 122, 222 ) to house a microstructure ( 26, 126, 226 ). In one embodiment, the microdevice ( 20 ) comprises a substrate ( 30 ), a cap ( 50 ) and an isolation layer ( 70 ). The substrate ( 30 ) has a plurality of conductive traces ( 38 ) formed on at least a portion of its top side ( 32 ) and outer edge ( 36 ). The conductive traces ( 38 ) provide electrical conductivity to the microstructure ( 26 ). The isolation layer ( 70 ) is attached between an outer edge of a sidewall ( 54 ) of the cap ( 50 ) and the plurality of conductive traces ( 38 ). The cavity ( 22 ) is at least partially defined by a recess ( 56 ) in the cap ( 50 ). There is also a microdevice ( 120 ) comprising a substrate ( 130 ), a cap ( 150 ) and a plurality of via covers ( 170 ). The substrate ( 130 ) has conductive vias ( 196 ) that terminate at a contact point ( 146 ) within the sealed cavity ( 122 ). The via covers ( 170 ) are attached to the substrate ( 130 ) to provide a hermetic seal. There is a further microdevice ( 220 ) comprising a substrate ( 230 ), a cap ( 250 ), and a plurality of conductive members ( 270 ). The cap ( 250 ) has conductive vias ( 296 ) that terminate at the conductive members ( 270 ). The conductive members ( 270 ) are electrically connected to the microstructure ( 226 ). There are also methods of forming the microdevice ( 20, 120, 220 ).</p> |
