Heat sink module for electronic components or circuits and method for its manufacture

摘要

The module has a base for contacting an electronic component or circuit, where the base has a substrate material and an internal structure with a duct structure. Cooling medium e.g. water and oil, flows through ducts of the duct structure, and a diamond layer is applied to surface areas of the base and the internal structure, which is in contact with the cooling medium. The surfaces coated with the diamond layer are made of material selected from a group consisting of copper, copper alloy, copper composite substance with molybdenum or tungsten. An independent claim is also included for a method for manufacturing a heat sink module.