Multilayer printed wiring board

摘要

A multilayer printed wiring board having a structure that outer conductor circuit patterns (5) are formed on a core substrate (1) having inner conductor circuit patterns (4) formed thereon through interlaminar resin insulating layers (2), and through-holes (9) are formed in the substrate for electrically connecting the inner conductor circuit patterns (4) to each other. A filler (10) is filled in the through-hole (9). The same kind of roughened layers (11) are formed on the inner conductor circuit pattern (4) on the substrate (1) over a full surface including a side surface thereof. The interlaminar resin insulating layer (2) formed covering the inner conductor circuit patterns (4) is flat. The outer conductor circuit pattern (5) is comprised of an electroless plated layer (12) formed on the interlaminar resin insulating layer (2) and an electrolytic plated layer (13) formed on the electroless plated layer (12).