Electrical isolation of monolithic circuits using a conductive through-hole in the substrate

摘要

A monolithic electronic chip including a substrate (100) having first and second opposing surfaces with a first circuit portion (210) disposed on at least one of the first or second opposing surfaces and a first circuit (102) formed on the first circuit portion of the substrate; a second circuit portion (212) disposed on at least one of the first or second opposing surfaces; and a second circuit (104) formed on the second circuit portion of the substrate. At least one through-hole (201) extending from the first surface to the second surface with at least one conductive impedance tap (200, 214). Each conductive impedance tap is formed within one of the at least one through-hole (201) in the substrate and coupled to a surface of that through-hole to electrically couple the substrate to a reference voltage (202). Tthe first impedance (204) between the first circuit (102) and the reference voltage (202) via the at least one conductive impedance tap (200, 214) is less than a first-second crosstalk impedance (106) between the first circuit and the second circuit via the substrate (100) and a second impedance (206) between the second circuit (104) and the reference voltage (202) via the at least one conductive impedance tap (200, 241) is less than the first-second crosstalk impedance (106).