发明名称 |
CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE FOR CIRCUIT MEMBER USING THE SAME AND PRODUCTION METHOD THEREOF |
摘要 |
The circuit-connecting material of the present invention is a circuit-connecting material for connecting a first circuit component having a plurality of first circuit electrodes on a main surface of a first circuit board and a second circuit component having a plurality of second circuit electrodes on a main surface of a second circuit board, in such a manner that the first circuit electrodes and the second circuit electrodes are electrically connected while being opposed to one another; wherein the circuit-connecting material contains an adhesive composition, conductive particles, and a plurality of insulating particles containing one or both of polyamic acid particles and polyimide particles. |
申请公布号 |
EP2056406(A1) |
申请公布日期 |
2009.05.06 |
申请号 |
EP20070792046 |
申请日期 |
2007.08.06 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TATSUZAWA, TAKASHI;KOBAYASHI, KOUJI;FUKUSHIMA, NAOKI;KOBAYASHI, TAKANOBU;ITO, AKIHIRO |
分类号 |
H01R11/01;C09J9/02;C09J11/08;C09J201/00;H01B1/22;H05K1/14;H05K3/36 |
主分类号 |
H01R11/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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