发明名称 |
CALL SETUP LATENCY REDUCTION BY ENCAPSULATING SIGNALLING MESSAGES |
摘要 |
<p>Techniques for minimizing call setup latency are disclosed. In one aspect, multiple signaling messages are encapsulated and sent as a single message thus reducing the total delay incurred by sequential transmission. In one embodiment, an encapsulation message includes a field indicating the number of messages encapsulated therein. In one example, the encapsulation is performed at a Link Access Control (LAC) layer. Alternate embodiments may perform encapsulation at an alternate layer.</p> |
申请公布号 |
EP1417818(B1) |
申请公布日期 |
2009.05.06 |
申请号 |
EP20020757142 |
申请日期 |
2002.08.16 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
SINNARAJAH, RAGULAN;ACHOUR, BAAZIZ;WANG, JUN |
分类号 |
H04J13/00;H04L29/06;H04L1/16;H04L1/18;H04L12/28;H04L12/56;H04W28/04;H04W28/06;H04W28/18;H04W72/04;H04W76/02 |
主分类号 |
H04J13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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