发明名称 CALL SETUP LATENCY REDUCTION BY ENCAPSULATING SIGNALLING MESSAGES
摘要 <p>Techniques for minimizing call setup latency are disclosed. In one aspect, multiple signaling messages are encapsulated and sent as a single message thus reducing the total delay incurred by sequential transmission. In one embodiment, an encapsulation message includes a field indicating the number of messages encapsulated therein. In one example, the encapsulation is performed at a Link Access Control (LAC) layer. Alternate embodiments may perform encapsulation at an alternate layer.</p>
申请公布号 EP1417818(B1) 申请公布日期 2009.05.06
申请号 EP20020757142 申请日期 2002.08.16
申请人 QUALCOMM INCORPORATED 发明人 SINNARAJAH, RAGULAN;ACHOUR, BAAZIZ;WANG, JUN
分类号 H04J13/00;H04L29/06;H04L1/16;H04L1/18;H04L12/28;H04L12/56;H04W28/04;H04W28/06;H04W28/18;H04W72/04;H04W76/02 主分类号 H04J13/00
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