| 摘要 |
An apparatus for housing a heat transfer element 5 of an under floor heat transfer system, the apparatus comprises at least one upper panel 6 and at least one lower panel 1. Upper 6 and lower 1 panels have an array of features (2, figs 1a & 5) on a surface of the panels 1, 6. The features (2) being such that when the at least one upper panel 6 is placed over the at least one lower panel 1, the respective features (2) cooperate with each other so as to position the upper panel 6 relative to the lower 1 panel and define spaces formed between the panels 1, 6. The heat transfer element 5 is accommodated in the spaces. Panels 1, 6 may be metallic. Features on the upper panel 6 may be an array of circular protrusions and features on the lower panel 1 may be raised circular apertures (2) through which the protrusions pass. A locking plate (3, fig 2) with apertures (4) cooperates with the raised circular apertures of a plurality of lower panels 1 to connect them together. An edge profile 8 comprising a polyurethane expansion strip (13, fig 8) may be provided. Upper panel 6 may have apertures 7 through which screed may be poured to fill the volume of the space formed between the interlocked lower 1 and upper panels 6. |
