| 摘要 |
The invention provides a manufacturing apparatus in which inter-substrate transfer of a thin film circuit or a thin film element can automatically be performed. An apparatus for manufacturing electronic devices includes a laser device to generate laser beams, a masking unit having a masking substrate to shape beam spots of the laser beams, a first stage to place a first substrate, which carries a object to be transferred, a second stage to place a second substrate, to which the object to be transferred is transferred, an adhesive agent applying unit to apply an adhesive agent on the object to be transferred or on a transferred position on the second substrate, and a control unit to control the actions of the first and the second stages. The control unit transfers the object to be transferred from the first substrate to the second substrate by moving at least one of the first and the second stages to perform inter-substrate alignment of the masking substrate, the first and the second substrates, adhering the first and the second substrates, irradiating a laser beam onto the object to be transferred, and moving the first and the second substrates away from each other. |
