发明名称 |
Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device |
摘要 |
A semiconductor device which uses a semiconductor element having main current input/output electrodes, one and the other of which are extended up to a one surface and a remaining surface of a semiconductor chip respectively for causing one of the input/output electrodes to be contacted with a conductive layer of a insulating substrate, whereby the semiconductor element is supported on or above the insulating substrate. A conductive strip which is made of a composite material of carbon and aluminum or a composite material of carbon and copper is used for connection between the remaining input/output electrode of the semiconductor chip and the conductive layer of the insulating substrate.
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申请公布号 |
US7528485(B2) |
申请公布日期 |
2009.05.05 |
申请号 |
US20050191942 |
申请日期 |
2005.07.29 |
申请人 |
HITACHI, LTD. |
发明人 |
MORITA TOSHIAKI;HOZOJI HIROSHI;SUZUKI KAZUHIRO |
分类号 |
H01L23/48;H01L23/40;H01L23/52 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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