发明名称 Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device
摘要 A semiconductor device which uses a semiconductor element having main current input/output electrodes, one and the other of which are extended up to a one surface and a remaining surface of a semiconductor chip respectively for causing one of the input/output electrodes to be contacted with a conductive layer of a insulating substrate, whereby the semiconductor element is supported on or above the insulating substrate. A conductive strip which is made of a composite material of carbon and aluminum or a composite material of carbon and copper is used for connection between the remaining input/output electrode of the semiconductor chip and the conductive layer of the insulating substrate.
申请公布号 US7528485(B2) 申请公布日期 2009.05.05
申请号 US20050191942 申请日期 2005.07.29
申请人 HITACHI, LTD. 发明人 MORITA TOSHIAKI;HOZOJI HIROSHI;SUZUKI KAZUHIRO
分类号 H01L23/48;H01L23/40;H01L23/52 主分类号 H01L23/48
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