| 发明名称 |
Surface acoustic wave device, package for the device, and method of fabricating the device |
| 摘要 |
A surface acoustic wave device includes a package having a cavity, a SAW chip housed in the cavity, a resin sealing the cavity, and a metal thin film provided on the resin.
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| 申请公布号 |
US7528522(B2) |
申请公布日期 |
2009.05.05 |
| 申请号 |
US20040883847 |
申请日期 |
2004.07.06 |
| 申请人 |
FUJITSU MEDIA DEVICES LIMITED |
发明人 |
MASUKO SHINGO;MISHIMA NAOYUKI |
| 分类号 |
H01L41/08;H03H9/25;H01L41/053;H03H3/08;H03H9/02;H03H9/10 |
主分类号 |
H01L41/08 |
| 代理机构 |
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代理人 |
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