发明名称 |
Planar vertical resistor and bond pad resistor and related method |
摘要 |
Resistors that avoid the problems of miniaturization of semiconductor devices and a related method are disclosed. In one embodiment, a resistor includes a planar resistor material that extends vertically within at least one metal layer of a semiconductor device. In another embodiment, a resistor includes a resistor material layer extending between a first bond pad and a second bond pad of a semiconductor device. The two embodiments can be used alone or together. A related method for generating the resistors is also disclosed.
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申请公布号 |
US7528048(B2) |
申请公布日期 |
2009.05.05 |
申请号 |
US20070954782 |
申请日期 |
2007.12.12 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COOLBAUGH DOUGLAS D.;DALTON TIMOTHY J.;EDELSTEIN DANIEL C.;ESHUN EBENEZER E.;GAMBINO JEFFREY P.;PETRARCA KEVIN S.;STAMPER ANTHONY K.;VOLANT RICHARD P. |
分类号 |
H01L21/20 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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