| 摘要 |
A heat treating apparatus includes a heating plate for heating a substrate coated with a coating liquid, a cooling plate for cooling the substrate and a heat pipe provided in the cooling plate, a cooling chamber being moved together with the cooling plate by the drive mechanism and accommodating a cooling liquid for cooling one end side of the heat pipe. The apparatus further includes a circulation passage provided in the heat treating apparatus to circulate the cooling liquid in the cooling chamber, a circulation pump for circulating the cooling liquid in the circulation passage; and a heat radiating member provided on the circulation passage to radiate the heat received by the cooling chamber to the outside of the heat treating apparatus.
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