发明名称 Substrate processing apparatus and substrate processing method
摘要 A method for performing a predetermined process on a substrate having coating film formed thereon includes preparing a data base denoting a relationship between each of parameters and a processing time of a predetermined process and storing the data base in a control section. The parameters include the temperature of a disposing plate, a supply rate of an ammonia gas, and an amount of a water vapor contained in the ammonia gas. The method further includes inputting a preset specific time value of the process into the control section; calculating candidate values of the parameters to finish the predetermined process by the specific time value; and determining specific values of the parameters to be used, based on the candidate values.
申请公布号 US7527827(B2) 申请公布日期 2009.05.05
申请号 US20050099655 申请日期 2005.04.06
申请人 RICOH COMPANY, LTD. 发明人 UEDA YUJI
分类号 B05D3/04;B05D3/10;B05C9/14;H01L21/00;H01L21/31 主分类号 B05D3/04
代理机构 代理人
主权项
地址