发明名称 Semiconductor constructions
摘要 The invention encompasses methods of forming metal nitride proximate dielectric materials. The metal nitride comprises two portions, with one of the portions being nearer the dielectric material than the other. The portion of the metal nitride nearest the dielectric material is formed from a non-halogenated metal-containing precursor, and the portion of the metal nitride further from the dielectric material is formed from a halogenated metal-containing precursor. The methodology of the present invention can be utilized for forming capacitor constructions, with the portion of the metal nitride formed from the halogenated metal-containing precursor being incorporated into a capacitor electrode.
申请公布号 US7528435(B2) 申请公布日期 2009.05.05
申请号 US20060477958 申请日期 2006.06.28
申请人 MICRON TECHNOLOGY, INC. 发明人 ZHENG LINGYI A.;PING ER-XUAN
分类号 H01L31/119 主分类号 H01L31/119
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