发明名称 Preparation of heat transfer member and heat-dissipating structure
摘要 A heat transfer member is prepared by applying a silicone composition onto a substrate to form an uncured silicone coating, and heat curing the coating to form a silicone heat conductor including a cured skin layer on the outer surface side and a low hardness layer on the inner surface side. The silicone composition comprises (a) an organopolysiloxane having alkenyl groups, (b) a heat conductive filler, (c) an organohydrogenpolysiloxane having Si-H groups, (d) an addition reaction catalyst, and (e) a volatile compound having one alkenyl group allowing for addition of an Si-H group thereto.
申请公布号 US7527830(B2) 申请公布日期 2009.05.05
申请号 US20050297481 申请日期 2005.12.09
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 ASAINE MASAYA
分类号 B05D3/02 主分类号 B05D3/02
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