| 发明名称 |
Self-encapsulated silver alloys for interconnects |
| 摘要 |
Alloys of silver and an alloying element that diffuses to the surface of the high conductivity metal and is oxidizable to form an alloying element oxide such as beryllium are provided along with electronic structures employing the alloys and methods of fabrication.
|
| 申请公布号 |
US7527188(B2) |
申请公布日期 |
2009.05.05 |
| 申请号 |
US20070620479 |
申请日期 |
2007.01.05 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
RONAY MARIA |
| 分类号 |
B23K31/02;C22C5/06;C22F1/14;H01L21/31;H01L21/3205;H01L21/76;H01L21/768;H01L23/52;H01L23/525 |
主分类号 |
B23K31/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
