发明名称 CLEANING DEVICE AND GRINDER OF WAFER
摘要 PROBLEM TO BE SOLVED: To safely and securely take up a wafer and to smoothly convey it to a prescribed conveyance destination after the wafer is held by a spinner table of a full installation type while a backside with a recess formed is exposed and cleaned. SOLUTION: An annular convex part 5A of the wafer 1 held by the spinner table 71 and cleaned is absorbed by an absorption pad 94 of a wafer take-up mechanism 90. An exposed surface-side is received by a robot pick 23c of a conveyance robot 23 and is absorbed and held. The conveyance robot 23 is operated and the wafer 1 is transported into a collection cassette 22B and stored therein. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009094247(A) 申请公布日期 2009.04.30
申请号 JP20070262597 申请日期 2007.10.05
申请人 DISCO ABRASIVE SYST LTD 发明人 KUWANA KAZUTAKA
分类号 H01L21/304;B65G49/07;H01L21/677 主分类号 H01L21/304
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