| 摘要 |
PROBLEM TO BE SOLVED: To aim high production efficiency of a resin material 9 and efficiently improve productivity of the product (resin molded body 18) in a mold 1 for resin sealing molding of an electronic component. SOLUTION: The mold 1 composed of an upper mold 2, a lower mold 3 and an intermediate mold 4 is provided with an intermediate type cavity corresponding part 8, a lower mold hole part 10 for supplying a resin material, and a resin-pressurizing block 11 for pressurizing the resin material 9 supplied to the hole part 10. A mold cavity 8 is formed with the cavity corresponding part 8 and a lower mold surface in mold-clamping the intermediate mold 4 and the lower mold 3, and an edge gate (short mold gate) 16 is formed between the cavity 8 and the hole part 10. The resin material 15 heated and melted in the hole part 10 coated with a mold-releasing film 17 is injected and filled in the cavity 8 by pressurizing with the resin-pressurizing block 11 through the edge gate 16, and the electronic component 5 mounted on a substrate 6 is sealed and molded in the resin molded body 16 corresponding to the shape of the mold cavity 8. COPYRIGHT: (C)2009,JPO&INPIT |
