METAL PARTICLE DISPERSION LIQUID, METHOD OF MANUFACTURING METAL PARTICLE DISPERSION LIQUID, METHOD OF MANUFACTURING CONDUCTIVE FILM-FORMED SUBSTRATE, AND ELECTRONIC DEVICE AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a metal particle dispersion liquid superior in dispersibility and stability in a dispersion medium, of which the baking temperature is suppressed low by combinedly using ultraviolet rays when being worked to a conductive film for such as wiring and conductive pattern; to provide a method of manufacturing the metal particle dispersion liquid capable of easily and surely manufacturing the metal particle dispersion liquid; also to provide a method of manufacturing a conductive film-formed substrate superior in performance and reliability and an electronic device and electronic equipment superior in performance and reliability. SOLUTION: The metal particle dispersion liquid is characterised in that it is constituted of a compound containing sulfur and a material containing a precious metal material; it contains metal particles having a particle size of 1-100 nm and a dispersion medium, and the metal particles are wrapped with the compound. It is preferable that the metal particles are mainly constituted of Ag. COPYRIGHT: (C)2009,JPO&INPIT