发明名称 RESIN COMPOSITION SHEET FOR SEALING HOLLOW DEVICE, AND HOLLOW DEVICE SEALED USING SHEET THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a resin composition sheet for sealing a hollow device with small warping to a base plate and a surface elastic wave element after sealing while restraining flowing of the sealing resin into the hollow portion and with good work stability when performing dicing, and a hollow device sealed using the sheet. SOLUTION: This resin composition sheet used for sealing an element requiring hollow sealing has the tension modulus of 1×10<SP>7</SP>-1×10<SP>9</SP>at 25°C after heat curing. And the hollow device is provided by sealing the element requiring hollow sealing using the resin composition sheet for sealing the hollow device. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009091389(A) 申请公布日期 2009.04.30
申请号 JP20070260455 申请日期 2007.10.04
申请人 NITTO DENKO CORP 发明人 TOYODA HIDESHI
分类号 C08J5/18;C08L21/00;C08L61/04;C08L63/00;C09K3/10;H01L23/29;H01L23/31 主分类号 C08J5/18
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