COATED CONDUCTIVE POWDER AND CONDUCTIVE ADHESIVE USING THE SAME

摘要

Disclosed is a coated conductive powder having excellent electrical reliability, wherein aggregation of conductive particles is suppressed. Also disclosed is a conductive adhesive using such a coated conductive powder, which is capable of forming an electrical connection of high reliability even for an electrode connection in miniaturized electronic devices such as IC chips or circuit boards. Specifically disclosed is a coated conductive powder which is obtained by coating the surfaces of conductive particles with insulating inorganic fine particles. The coated conductive powder is characterized by having a volume resistivity of not more than 1 O·cm. The coated conductive powder is also characterized in that the insulating inorganic fine particles have a specific gravity of not more than 5.0 g/ml, and the particle diameter ratio of the insulating inorganic fine particles to the conductive particles (insulating inorganic fine particles/conductive particles) is not more than 1/100. The coated conductive powder is further characterized in that the insulating inorganic fine particles are adhering to the surfaces of the conductive particles.