<p>Provided is a method for manufacturing with high productivity a printed wiring board having high dimensional stability. The manufacturing method is provided with a step of preparing a metallic laminated body wherein a metal layer having an inner metal layer section and a protection layer section is laminated on at least one side of an insulating resin layer, with the inner metal layer section on the side of the insulating resin layer; a step of forming a via hole on the metal layer and the insulating resin layer; a step of performing blast processing after forming the via hole; and a step of removing the protection layer section after performing blast processing.</p>
