CONDUCTIVE PARTICLE, CIRCUIT CONNECTING MATERIAL, AND CONNECTION STRUCTURE

摘要

Disclosed is a circuit connecting material (50) for connecting a first electrode and a second electrode facing each other, which contains an adhesive composition (52) and conductive particles (10) dispersed in the adhesive composition (52). Each conductive particle (10) comprises a core (12) mainly composed of a material having a melting point or softening point of T1 (°C), a conductive layer (14) covering the surface of the core (12) and mainly composed of a low-melting-point metal having a melting point of T2 (°C), and an insulating layer (16) covering the surface of the conductive layer (14) and composed of a resin composition having a softening point of T3 (°C). In this connection, T1, T2 and T3 satisfy the following formula (1). T1 > T2 > T3 (1)