ROBUST CONNECTIONS IN A MULTI-LAYER WOVEN FABRIC

摘要

The present invention relates to multilayer textiles for photonic and/or electronic applications. The textile (100) comprises a multilayer structure having a first and a second layer electrically separated by a third layer. The first layer comprises electrically insulating yarns (112) and at least one electrically conductive yarn (111). The second and third layers comprise electrically insulating yarns (132,122) in the weft direction. At least one via-connection is realized between an electrically conductive warp yarn (141) and the at least one electrically conductive weft yarn (111) of the first layer by a tight interweaving. Thus, the present invention provides a flexible textile (100) with robust via-connections.