| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor-sealing epoxy resin composition excellent in flame-resistance and excellent in flowability, continuous moldability and soldering-resistance. <P>SOLUTION: The semiconductor-sealing epoxy resin composition contains (A) an epoxy resin having a structure represented by general formula (1), (B) a compound containing two or more of phenolic hydroxyl groups, (C) an inorganic filler, (D) a curing promotor, and (E) a penta erythritol tetra-aliphatic acid ester (E1) and/or a dipentaerythritol hexa-aliphatic acid ester (E2). <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
