| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device in which a plurality of kinds of semiconductor chips can be manufactured at extremely reduced cost using the same semiconductor substrate. SOLUTION: The manufacturing method of the semiconductor device in which the plurality of kinds of semiconductor chips 1 to 9 differing in size are formed using the same semiconductor substrate 12, is provided, the manufacturing method including a first process of forming the plurality of kinds of semiconductor chips on the semiconductor substrate so that none of a plurality of scribe lines SL1<SB>X(n)</SB>formed continuously in a first direction at a plurality of different intervals and a plurality of scribe lines SL1<SB>Y(n)</SB>formed continuously in a second direction at a plurality of different intervals crosses the semiconductor chips 1 to 9, and a second process of dicing the semiconductor substrate along the plurality of scribe lines in the first direction and dicing the semiconductor substrate along the plurality of scribe lines in the second direction to separate the semiconductor substrate into a plurality of partial substrates including a single or a plurality of semiconductor chips. COPYRIGHT: (C)2009,JPO&INPIT
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