| 摘要 |
PROBLEM TO BE SOLVED: To prevent soldering layers from short-circuiting to each other owing to a "pop" wherein solder scatters when electronic circuit boards are electrically connected to each other with soldering layers through a connection member. SOLUTION: On a surface of an insulating substrate constituting the connection member 11, insulating barriers 11a are provided which projects in a beltlike shape, and a first conductor unit is formed between them. The electronic circuit boards 2 are placed on top and reverse surfaces of the connection member 1 to oppose the first conductor unit and a second conductor unit 22 to each other. Peak portions of the insulating barrier 11a abut against insulation areas 21a on the electronic circuit board 2 without any gap. Therefore, even if the "pop" wherein solder scatters is caused during soldering, the insulating barrier 11a block it to prevent a short circuit from being formed between adjacent soldering layers 3. COPYRIGHT: (C)2009,JPO&INPIT
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