| 摘要 |
A PCB having an adhesive layer and a semiconductor package using the same. The PCB includes a body substrate, a solder resist layer including an open portion that exposes a portion of the body substrate, and an adhesive layer formed on the body substrate in the open portion. The adhesive layer may include a solid die attach film or a liquid adhesive. A semiconductor chip may be attached to the adhesive layer. The semiconductor chip and the PCB may be molded by an encapsulant, thereby substantially covering the semiconductor chip and the PCB with the encapsulant.
|
