发明名称 |
SEMICONDUCTOR MODULES AND ELECTRONIC DEVICES USING THE SAME |
摘要 |
Semiconductor devices and electronic devices using the same. The semiconductor module may include a first semiconductor chip, and a module substrate having a top surface on which the first semiconductor chip is mounted and a second surface opposite the top surface, wherein the module substrate includes a first buffer layer to relieve stress occurring due to a difference of thermal expansions between the first semiconductor chip and the module substrate. |
申请公布号 |
US2009109642(A1) |
申请公布日期 |
2009.04.30 |
申请号 |
US20080249047 |
申请日期 |
2008.10.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHUNG HYUN-SOO;LEE DONG-HO;HWANG SEONG-DEOK;KANG SUN-WON;KIM KI-HYUK |
分类号 |
H05K7/00 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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