| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device which is reliable and can be improved in yield. <P>SOLUTION: The light emitting device 100 includes a light emitting portion 10 where a light emitting element is disposed, an insulating substrate 20 where the light emitting portion 10 is mounted on its top surface and a conductive member electrically connected to the light emitting element is disposed, a heat sink (heat dissipation member) 30 disposed right below the insulating substrate 20, and at least a pair of lead terminals 40a and 40b connected to the conductive member. The lead terminals 40a and 40b have connection terminal portions disposed right above the heat sink (heat dissipation member) 30 and connected to the conductive member, and bent portions bent to link lead tip portions connected to an external wiring circuit to the connection terminal portions. <P>COPYRIGHT: (C)2009,JPO&INPIT |
