发明名称 PROCESS FOR PRODUCING CONTACT AND PRINTED CIRCUIT PACKAGE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a process for producing electrical contact connections for at least one component which is integrated in a substrate material including a first surface region. <P>SOLUTION: At least one connection contact for each component is arranged at least partly on the first surface region. This process is characterized in that a cover element is placed on the first surface region, and at least one contact passage intersects with the first surface region at a right angle and extends in the substrate material. In order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection is produced via respective contact passages between at least one of the contact locations and connection contacts. This type of contact locations can be formed on the surface of the substrate material at the opposite side of the connection contacts. As a result, the contact location are electrically connected to the connection contacts on the surface of the substrate material at the opposite side of an active surface. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009094540(A) 申请公布日期 2009.04.30
申请号 JP20090012968 申请日期 2009.01.23
申请人 SCHOTT AG 发明人 BIECK FLORIAN;LEIB JUERGEN
分类号 H01L21/3205;H01L23/52;H01L;H01L21/00;H01L21/44;H01L21/76;H01L21/768;H01L23/00;H01L23/12;H01L23/31;H01L23/485;H01L25/16;H01L27/146;H01L31/02;H01L31/0203 主分类号 H01L21/3205
代理机构 代理人
主权项
地址