发明名称 SOLDERING METHOD, AND REFLOW SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To solve the problem that a conventional soldering method using an ultrasonic wave has troublesome matters of breakage, a decrease in throughput, etc., accompanying higher temperature of an ultrasonic vibrator. SOLUTION: A soldering method includes a first process of supplying solder to a member to be connected and setting it on a stage in a reflow furnace, a second process of raising the temperature in the reflow furnace up to temperature at which at least the solder is fused, a third process of putting a sound electrode connected to the ultrasonic vibrator close to the member to be connected while the solder is fused and applying vibrations to the member to be connected, and a fourth process of putting the sound electrode connected to the ultrasonic vibrator away from the member to be connected and lowering the temperature in the reflow furnace to solidify the solder. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009094370(A) 申请公布日期 2009.04.30
申请号 JP20070265070 申请日期 2007.10.11
申请人 HITACHI LTD 发明人 NAKATSUKA TETSUYA;SERIZAWA KOJI
分类号 H05K3/34;B23K1/005;B23K1/008;B23K1/06;B23K101/42 主分类号 H05K3/34
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